Will Garside
Will Garside on why Intel's annual partner event is like a dunk in a cold bath
Will Garside
ITP delivers 10 percent uplift while UltraBook aims to take a bite out of Apple
Mark Oakley
USB 3.0 Promoter Group announces plans for new USB power specification
New certification which will form backbone of vendor’s partner programme
Mark Oakley
Chip maker unveils new microprocessor architecture and upholds Moore's Law in energy-efficient design
Will Garside
More distis planned, specialisations and entry into adjacent markets on the roadmap as Intel finally embraces the channel
Will Garside
Largest motherboard, chassis and module range arriving later this year to give channel edge in customisation
Mark Oakley
Motherboards housing new B3 stepping chipsets are announced
Mark Oakley
Not-too subtle dig at rival’s recent Sandy Bridge problems
Mark Oakley
HP, MSI, Dell and ASUS all halt sales as returns policies are put into place